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Effects of package geometry on thermal fatigue life and microstructure of Sn-Ag-Cu solder joint.

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    • Abstract:
      Soldering experiments of chip scale package devices were carried out by means of diode laser soldering system with Sn-Ag-Cu solders. In addition, pull tests and a scanning electron microscope were used to analyse the effect of processing parameters on mechanical strength of solder joints. Viscoplastic finite element simulation was utilised to predict solder joint reliability for different package geometry under accelerated temperature cycling conditions. The results indicate that under the conditions of laser continuous scanning mode as well as the fixed soldering time, an optimal power and package geometry exists, while the optimal mechanical properties of microjoints are gained. [ABSTRACT FROM AUTHOR]
    • Abstract:
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