Item request has been placed! ×
Item request cannot be made. ×
loading  Processing Request
Item request has been placed! ×
Item request cannot be made. ×
loading  Processing Request
Academic Journal

Effects of package geometry on thermal fatigue life and microstructure of Sn-Ag-Cu solder joint.

Subjects: *THERMAL fatigue; *SOLDER joints; *FINITE element method

  • Source: Materials Science & Technology. Nov2011, Vol. 27 Issue 11, p1686-1693. 8p.

Record details

×
  • 1-4 of  4 results for ""Li, X.-B.""