Item request has been placed! ×
Item request cannot be made. ×
loading  Processing Request

Search Results

Filter
  • 1-10 of  16 results for ""Liu, D.""
Item request has been placed! ×
Item request cannot be made. ×
loading  Processing Request
Academic Journal

INFLUENCES OF MATERIAL SOURCE, WAFER PROCESS AND LOCATION ON SILICON DIE FRACTURE STRENGTH.

Subjects: *FRACTURE mechanics; *BENDING (Metalwork); *TESTING

  • Source: Experimental Techniques. Nov/Dec2002, Vol. 26 Issue 6, p29-35. 7p. 3 Black and White Photographs, 2 Diagrams, 2 Charts, 4 Graphs.

Record details

×
Academic Journal

Element Size Effect on Phase Aberration Correction.

Subjects: *BEAM dynamics

  • Source: IEEE Transactions on Ultrasonics Ferroelectrics & Frequency Control. Sep2002, Vol. 49 Issue 9, p1212. 10p. 5 Black and White Photographs, 2 Diagrams, 8 Graphs.

Record details

×
  • 1-10 of  16 results for ""Liu, D.""